Microsystem packaging, assembly and testing

In this unit, you’ll cover a broad range of packaging techniques, from traditional methods like leaded and leadless packages, surface mount technology (SMT), and ball grid arrays (BGA), to advanced approaches including 2.5D and 3D packaging, optoelectronics packaging, MEMS and sensor packaging, and memory packaging. You will explore both practical and theoretical aspects of wire bonding, wafer bonding, dicing, and assembly. You will also gain an understanding of key concepts such as reliability analysis, electric shielding, electrostatic discharge, thermal management, and failure analysis under environmental conditions.