ECE4831 Microsystem packaging, assembly and testing
Faculty of Engineering
ECE4831 Microsystem packaging, assembly and testing is a level 4, 6-credit-point, undergraduate unit from the Faculty of Engineering. It isn't offered in 2026. It has no prerequisites.
- Credit points
- 6
- Offered in 2026
- Not offered
- Assessment
- Exam 60%
- and 2 other tasks
- Workload
- 144 hours
- per semester
This is the 2026 handbook entry. See the 2027 entry.
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Requisites
Before ECE4831
Prohibitions
You can't enrol if you have passed any of these.
After ECE4831
No unit lists ECE4831 as a prerequisite in the 2026 handbook.
Enrolment rules
Must be enrolled in a Bachelor course owned by Engineering
Prerequisite:
Completion of 72 credit points of units owned by Engineering
Equivalent units
The same content under another code. Only one of them counts.
Overview
This unit cover all kinds of packaging from traditional techniques such as leaded and leadless packages, surface mount technology (SMT), and ball grid array (BGA) to advanced packaging techniques including: 2.5D and 3D packaging, Optoelectronics packaging, MEMS and Sensors packaging, Memory packaging. You will also explore practical and theoretical aspects in wire bonding, die bonding, wafer bonding, dicing, assembly. You will also be exposed to detailed concepts related to reliability study, electric shielding, electrostatic discharge, thermal management, failure analysis due to environmental conditions.
Offerings in 2026
The 2026 handbook lists no offerings for ECE4831.
Assessment
- AssignmentsProject20%
- Lab and presentationDemonstration20%
- Tests and quizzesExamination10%
- Final examinationExamination50%
Assessment details may change. Please refer to the assessment information in Moodle closer to the start of the teaching period.
Learning outcomes
When you finish this unit, you should be able to:
- 1
Compare different traditional and advanced packaging technologies such as surface mount, ball grid array, 2.5D and 3D packaging employed in the semiconductor industry.
- 2
Demonstrate dicing of wafer and wire bonding die to printed circuit board.
- 3
Interpret challenges and failures in packaging, assembly, reliability of chip and communicate with semiconductor backend experts.
- 4
Analyse reliability of given integrated circuit chips and work in a team to prepare a data sheet detailing the results.
Workload and teaching
- Teaching approachSimulation or virtual practice
- Teaching approachProblem-based learning
- Teaching approachActive learning
The minimum total expected workload to achieve the learning outcomes for this unit is 144 hours per semester typically comprising a mixture of 3-6 hours of scheduled learning activities and 6-9 hours of independent study per week. Scheduled activities may include a combination of teacher-directed learning, peer-directed learning and online engagement. Independent study may include associated readings, assessment and preparation for scheduled activities.
You will participate in guided, immersive experiences designed to build relevant skills, knowledge, and attitudes through simulation and virtual practice.
To deepen your understanding of key concepts and principles and support the application of knowledge, you will be given problems to solve individually or in small groups.
This unit includes interactive workshops designed to reinforce lecture content through individual and group participation in structured activities.
Where it fits
ECE4831 is part of 1 area of study in the 2026 handbook.
Common questions
What are the prerequisites for ECE4831?
ECE4831 has no prerequisites, but enrolment rules apply.
When is ECE4831 offered?
ECE4831 has no offerings listed in the 2026 handbook.
How much work is ECE4831?
The handbook expects about 144 hours of study across the semester. No students have rated its difficulty yet.
Does ECE4831 have an exam?
Yes. The exam is worth 60% of the final mark, alongside 3 other tasks.
Which majors and minors include ECE4831?
ECE4831 is part of Semiconductor.
More details
- Credit points
- 6
- Level
- 4
- Study level
- Undergraduate
- Faculty
- Faculty of Engineering
- Organisational unit
- Department of Electrical and Computer Systems Engineering
- Type
- Coursework
- EFTSL
- 0.125
- Student contribution
- SCA Band 2
- Study abroad
- Available
- Handbook years
- 20262027