ECE5831 Microsystem packaging, assembly and testing
Faculty of Engineering
ECE5831 Microsystem packaging, assembly and testing is a level 5, 6-credit-point, postgraduate unit from the Faculty of Engineering, offered in 2026 in Semester 2 at Malaysia. It has no prerequisites.
- Credit points
- 6
- Offered in 2026
- Semester 2
- Malaysia
- Assessment
- Exam 60%
- and 2 other tasks
- Workload
- 144 hours
- per semester
The 2027 handbook has no page for ECE5831. This is its 2026 entry, the latest one.
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Requisites
Before ECE5831
No prerequisites or corequisites besides the enrolment rules below.
After ECE5831
No unit lists ECE5831 as a prerequisite in the 2026 handbook.
Enrolment rules
You must be currently enrolled in a master’s course in engineering or related STEM and in a related discipline. The unit assumes that you have the necessary foundational knowledge.
Equivalent units
The same content under another code. Only one of them counts.
Overview
In this unit, you’ll cover a broad range of packaging techniques, from traditional methods like leaded and leadless packages, surface mount technology (SMT), and ball grid arrays (BGA), to advanced approaches including 2.5D and 3D packaging, optoelectronics packaging, MEMS and sensor packaging, and memory packaging. You will explore both practical and theoretical aspects of wire bonding, wafer bonding, dicing, and assembly. You will also gain an understanding of key concepts such as reliability analysis, electric shielding, electrostatic discharge, thermal management, and failure analysis under environmental conditions.
Offerings in 2026
| Teaching period | Campus | Mode |
|---|---|---|
| Second semester | Malaysia | On campus |
Assessment
- AssignmentsProject20%
- Laboratory and presentationDemonstration20%
- TestExamination10%
- Final assessmentExamination50%
Assessment details may change. Please refer to the assessment information in Moodle closer to the start of the teaching period.
Learning outcomes
When you finish this unit, you should be able to:
- 1
Compare different traditional and advanced packaging technologies such as surface mount, ball grid array, 2.5D and 3D packaging employed in the semiconductor industry.
- 2
Demonstrate dicing of wafer and wire bonding die to printed circuit board.
- 3
Interpret challenges and failures in packaging, assembly, reliability of chip and communicate with semiconductor backend experts.
- 4
Analyse reliability of given IC chips and work in a team to prepare a data sheet detailing the results.
Workload and teaching
- Laboratories36 hours
- Workshops24 hours
- Teaching approachProblem-based learning
- Teaching approachResearch activities
- Teaching approachActive learning
- Teaching approachSimulation or virtual practice
The minimum total expected workload to achieve the learning outcomes for this unit is 144 hours per semester typically comprising a mixture of 3-6 hours of scheduled learning activities and 6-9 hours of independent study per week. Scheduled activities may include a combination of teacher-directed learning, peer-directed learning and online engagement. Independent study may include associated readings, assessment and preparation for scheduled activities.
To deepen your understanding of concepts and principles, you will take on problem-solving tasks either to complete individually or in small group settings.
You will develop research skills through structured inquiry, preparing research proposals using a systematic approach and methodologies specific to your discipline.
You will participate in interactive workshops and computer laboratories to deepen your knowledge of lecture content through individual or group activities.
You will participate in guided, immersive experiences to build relevant skills, knowledge and professional attitudes through simulation or virtual practice.
Where it fits
ECE5831 is part of 1 area of study in the 2026 handbook.
Contacts
- Chief Examiners
- Associate Professor Narayanan Ramakrishnan
- Unit Coordinators
- Associate Professor Narayanan Ramakrishnan
Common questions
What are the prerequisites for ECE5831?
ECE5831 has no prerequisites, but enrolment rules apply.
When is ECE5831 offered?
In 2026, ECE5831 runs in Semester 2 at Malaysia.
How much work is ECE5831?
The handbook expects about 144 hours of study across the semester. No students have rated its difficulty yet.
Does ECE5831 have an exam?
Yes. The exam is worth 60% of the final mark, alongside 3 other tasks.
Which majors and minors include ECE5831?
ECE5831 is part of Semiconductor and microsystems engineering .
More details
- Credit points
- 6
- Level
- 5
- Study level
- Postgraduate
- Faculty
- Faculty of Engineering
- Organisational unit
- Department of Electrical and Computer Systems Engineering
- Type
- Coursework
- EFTSL
- 0.125
- Student contribution
- SCA Band 2
- Study abroad
- Available
- Handbook years
- 2026